2,6-Bis[(di-tert-butylphosphino)methyl]pyridine silver(I) tetrafluoroborate

0.97

98%

溴甲烯基二甲基溴化铵

0.95

98%

(R)-(-)-N-[1-(1-萘基)乙基]邻氨甲酰苯甲酸

0.98

99%

(R)-1-[(SP)-2-(Dicyclohexylphosphino)ferrocenyl]ethyldi-tert-butylphosphine palladium(II) dichloride

≥97%

≥98%

(R)-(+)-1-氯-3-(4-氟苯氧基)-2-丙醇

0.97

98%

聚合物键合型 Rink 酰胺 4-甲基二苯甲胺

Rink Amide-MBHA Resin

0.3~0.8mmol/g, 100~2...

5-苄基-4-苯基-4H-1,2,4-三唑-3-硫醇

5-Benzyl-4-Phenyl-4H-1,2,4-Triazole-3-Thiol

Fmoc-Pro-王氏树脂

Fmoc-Pro-Wang resin

100-200 mesh, 1%DVB,...

(R)-(+)-4-甲氧基扁桃腈

0.98

99%

(R)-(+)-N,N-二甲基-1-(1-萘基)乙胺

0.96

96%

(R)-(+)-N-(1-苯乙基)琥珀酰胺酸

0.98

99%

(R)-(-)-安息香

0.98

99%

1-[3-(quinolin-2-ylmethoxy)phenyl]hexan-1-ol

REV 5901

≥99%

(2S)-5,7-dimethoxy-8-(3-methylbut-2-enyl)-2-phenyl-2,3-dihydrochromen-4-one

≥95% (LC/MS-ELSD)

≥98%（LC/MS-ELSD）

(1S,3R)-1-[[(2S,3R)-3-ethenyl-5-methoxycarbonyl-2-[(2S,3R,4S,5S,6R)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxy-3,4-dihydro-2H-pyran-4-yl]methyl]-2,3,4,9-tetrahydro-1H-pyrido[3,4-b]indole-3-carboxylic acid

≥95% (LC/MS-ELSD)

≥98%（LC/MS-ELSD）

1-(苄氧基)-4-溴-2,3-二氟苯

1-(Benzyloxy)-4-bromo-2,3-difluorobenzene

98%

3-(4′-甲氧基苄氧)苯硼酸

3-(4′-Methoxybenzyloxy)phenylboronic acid

98%

N-O-nitrophenylsulfenyl-L-asparagine*dcha

N-O-nitrophenylsulfenyl-L-asparagine*dcha

结晶

PEG-250 二硬脂酸酯

poly(ethylene glycol) distearate

熔点：>64℃

3-甲基-1H-1,2,4-三氮唑

3-Methyl-1H-1,2,4-trizole

98%